Spec

• This product is a headphone amplifier board assembly kit developed to upgrade the LV -2.0.
• It can be bolt-on added to the LV -2.0 BASIC model for better headphone output. (Included with PREMIUM models)
• In addition to being incorporated into the LV -2.0, it can also be ***d as a stand-alone headphone amplifier.
• The parts are not mounted, so you can replace them with the parts of your choice and mount them.
• Features
• OP Amplifier Inverted Amplifier Circuit + Discrete Diamond Buffer Circuit Cross-Feed Circuit Improves In-Head Localization Sense (can be enabled/disabled by jumper setting) Output Impedance HIGH/LOW can be set by jumper
• Specifications
• Input Impedance: 10 kohms
• Recomm***ed headphone impedance: 3 ohms to 600 ohms * 1
• Rated power: 250 mW + 250 mW (33 ohm load) * 2
• : 150 mW + 150 mW (330 ohm load) # 3
• Frequency response: 5 Hz to 100 kHz or higher
• Residual noise: 10 uV or less
• Power supply voltage: +/- 5 V to +/- 15 V
• Voltage Gain: 0 dB (Modifiable by R3, R4)
• *1) For maximum output limit, when headphone impedance is 16 ~ 200 ohms, *** output impedance switching (SEL3) in HIGH mode.
• *2) 20 Hz to 20 kHz, THD + N = 1% or less, Ro = 14.7 ohms (output impedance HIGH), supply voltage +/- 12 V
• *3) 20 Hz to 20 kHz, THD + N = 0.1% or less, Ro = 4.7 ohms (output impedance LOW), supply voltage +/- 12 V
• External dimensions
• x width x height: 47 mm x 72 mm x 28.8 mm (without protrusions)
• Materials and technical information
• Explains and gives advice on this product.
• How to make a headphone amplifier kit (Related technical information) LV module combination
• 2.Production of High-Res USB-DAC + Headphone Amplifier
• http://select.marutsu.co.jp/list/detail.php?id=175