Features

• Gap Pad® 2200SF. Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework. Typical applications include digital disk drives, proximity near electrical contacts (e.g. DC brush motors, connectors, relays) and fibre optics modules. Thermal conductivity: 2.0 W/m-K Silicone-free formulation Medium compliance with easy handling Electrically isolating