Features

• Heat Sink 113AB Series, 150mm Wide x 25mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be ***d to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.