Features

• Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Pre-drilled to take 1 off TO3 metal can semiconuctor package. Low Profile Non-standard Extrusion With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be ***d to cool high power semiconductors, optoelectric devices and light emitting diodes.