Features

• Since the flux residue is completely non-corrosive, cleaning of the substrate after soldering is completely unnecessary.
• Long durability of activity, excellent spread rate and wettability of solder can speed up work.
• The residue is excellent in non-conductivity and non-hygroscopicity, and there is no generation of aging defects, making it ideal for high-density mounting substrates.
• Uses organic amine-based special active rosin (non-chlorine). Compatible with MIL-RMA standards.