Features

• UL
• TE Connectivity Substrate-Mounted Signal Relay - IM Series
• IM Series Thin Substrate-Mounted Signal Relay has a low profile with a height of 5.65 mm and occupies a minimal substrate space of 60mm2.
• The IM series thin substrate mounted signal relay has low power consumption coils of 140 mW (standard coil), 100 mW (bi-table), and 50 mW (ultra-sensitive type), high insulation surge capability, and mechanical shock resistance of 300 g.
• Features and Advantages: Thin and low profile -10 x 6 x 5.65 mm branched contact, gold-plated hermetic shield (RT V), IP67 High mechanical impact resistance up to 300 G (functional) and 500 G (survivable) Insulation resistance @ 500 V dc >; Excellent surge voltages (1.2/50 μs and 10/700 μs) conforming to 109 Ω Telcordia GR 1089, FCC Part 68, and ITU-T K20, 21, and 45 1500 V between open contacts and 2500 V between coils and contacts
• Application: Communication equipment Optical network terminals Office equipment Instruments Medical equipment On-board applications