Features

• UL 94V-0
• TE Connectivity AMPMODU 50/50 1.27 mm×1.27 mm Grid Substrate-to-Substrate Vertical Receptacle
• .050×.050 for SMT Parallel Substrate-to-Substrate Stacking AMPMODU 50/50 1.27 mm×1.27 mm Grid Substrate-to-Substrate Vertical Receptacle.
• By using the same receptacle and selecting the appropriate header (Substrate-to-Substrate.050 ×.050 Two-row vertical and light angle header), the parallel substrate-to-substrate stack is 6.35 mm, 8.13 mm, and 9.91 mm high.
• These AMPMODU 50/50 1.27 mm x 1.27 mm vertical SMT substrate-to-substrate receptacle connectors are equipped with a UL 94V-0 black glass fiber thermoplastic housing, substrate pushdown posts, polar tabs, and gold-plated contacts for infrared (IR) and vapor-phase reflow (VPR) surface mounting.