64-0199-41 Heatsink, BGA, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil ICK BGA 27x27x22
Electronic/Electrical Parts and Controll Equipments

64-0199-41 Heatsink, BGA, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil ICK BGA 27x27x22

model: 64-0199-41
brand: Fischer Elektronik

Product Description

Product Model: 64-0199-41Product Brand: Fischer Elektro […]

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Product Details

Product Model: 64-0199-41
Product Brand: Fischer Elektronik

Features

  • Fischer Elektronik ICK BGA Series Heatsink. ICK BGA series of heatsinks have been designed for *** within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and Benefits Black anodised surface. Heatsink dimensions match respective BGA-type. Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

Spec

  • Quantity:1piece/bag
  • For Use With:BGA
  • Length:27mm
  • Width:27mm
  • Height:22mm
  • Dimensions:27 x 27 x 22mm
  • Thermal Resistance:13.5K/W
  • Mounting:Adhesive Foil, Conductive Foil
  • Colour:Black
  • CODE No.:674-4753

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