Features

• Pitch: 1.27 mm (max. 40P connection), 2.54 mm (max. 20P connection) Materials: Pin ... Beryllium Copper Nickel Underlay Gold Plating Resin Section ... LCP Resin Black
• Rated Current: 1 A
• Rated Voltage: 125 V AC, DC
• Contact Resistance: 30 mΩ or Less
• Insulation Resistance: 500 MΩ or More
• Insulation Voltage: 1000 V, AC, DC1 minute
• Print Plate Compatible Through Hole: 0.8~0.9φTH Finishing Diameter (Contact Side)
• Print Plate Compatible Plate Thickness: 0.8~1.6 t
• Operating Temperature Range: -40 to +125°C
• Operating Humidity Range: 0~85%rh (No Condensation)
• Number of times of ***: 50 times or less
• This product can be ***d with 1 male or female. Since the socket is unnecessary, the height between the PC plate and the PC plate can be reduced. (1 mm to 10 mm) XB series soldering side also has spring property, so the product does not tilt and can stand upright. Both sides can also be soldered. Due to the rapid oxidation of copper, the connecting side cannot be ***d for copper through hole substrates.