Features

• Fischer Elektronik ICK BGA Series Heatsink. ICK BGA series of heatsinks have been designed for *** within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and Benefits Black anodised surface. Heatsink dimensions match respective BGA-type. Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).